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Mounting film bulk acoustic resonators in microwave packages using flip chip bonding technology
Mounting film bulk acoustic resonators in microwave packages using flip chip bonding technology
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机译:使用倒装芯片键合技术将薄膜体声谐振器安装在微波封装中
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摘要
A device includes a die that contains a filter circuit. The filter is implemented using film bulk acoustic resonators. A package contains the die. The package includes a base portion. Signal paths are incorporated in the base portion. Solder joints attach the die to the base portion. The solder joints electrically connect pads on the die to the signal paths in the base portion. The solder joints do not include, and are used instead of, wire bonds.
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