MICROWAVE PACKAGE DEVICE INCLUDING FILM BULK ACOUSTIC RESONATOR MOUNTED BY USING FLIP CHIP BONDING TECHNOLOGY AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a device that packages an RF transmission and reception switching device and a filter integrally, by minimizing overall dimension and its manufacturing method.;SOLUTION: This device is implemented using film bulk acoustic resonators (50 to 53 and 74 to 70) and has a die (12) that includes filter circuits (64 to 70), a base portion (18) and signal paths (19 and 20) incorporated in the base portion (18), a package (10) containing the die (12), and solder joints (13 and 14) for attaching the die (12) to the base portion (18) and electrically connecting pads on the die (12) to the signal paths (19 and 20) in the base portion (18).;COPYRIGHT: (C)2002,JPO