A method for the production of semiconductor chips with a chip edges protection, in particular for wafer level packing chips

摘要

The present invention provides a method for the production of semiconductor chip (1a, 1b, 1c; 1a ', 1b', 1c ') with a chip edges protection layer (21 ", 22"), in particular for wafer level packaging chips, comprising the steps of: providing a semiconductor wafer (1); providing of trenches (21, 22) in the semiconductor wafer for fixing the position of chip edges on a first side of the semiconductor wafer (1); filling of the trenches (21, 22) with a protection means (21'; 22 '); loop-back of the semiconductor wafer (1) of a second side of the semiconductor wafer (1), which is opposite the first side, in order to expose the with the protection means (21'; 22 ') filled trenches (21, 22); and severing of the with the protection means (21'; 22 ') filled trenches (21, 22), so that the chip edges protection layer (21 ", 22") of the guard means (21', 22 ') remains on the chip edges.