Adhesive bonding process for forming electrically conducting structures on a substrate comprises using a conducting adhesive or similar material having selected properties

摘要

Adhesive bonding process for forming electrically conducting structures on a substrate comprises using a conducting adhesive or similar material having selected properties to fit the electrical and/or mechanical requirements of the conducting structure to be formed. An Independent claim is also included for a device for producing electrically conducting structures on a substrate (4) comprising a dispensing arrangement (1) for applying the conducting adhesive (3) on the substrate. The dispensing arrangement has a number of individual capillaries (2) which run together in the extrusion region of the dispensing arrangement.