Opto-electronic arrangement, has adhesive unit arranged between connection support and chip and comprising of electrical conducting material, which provides electrical conducting connection between connection points and contact points

摘要

The arrangement has an opto-electronic semiconductor chip (1) e.g. laser diode, comprising a semiconductor body (10). An electrical isolating separation point (22) is arranged between connection points (21) of a connection support (2) i.e. printed circuit board, at a top side (20a) of a base body (20). An anisotropic adhesive unit (3) is arranged between the support and the chip, and comprises of an electrical conducting material, which provides an electrical conducting connection between the connection points and contact points (11) i.e. flip-chip contacts. The base body comprises of a ceramic material, plastic or metal. An independent claim is also included for a method for manufacturing multiple optoelectronic arrangements.