Production method null of hole burying ink and through hole printed circuit board for through hole printed circuit board production

摘要

PROBLEM TO BE SOLVED: To obtain a hole filling ink for the preparation of a through-hole printed wiring board which has a satisfactory curing depth, causes no significant volume shrinkage, has a good grindability, and can be easily removed with an alkali soln. by incorporating a specified monoester compd., a photopolymn. catalyst, a specified rosin, and the like. ;SOLUTION: This hole filling ink comprises 1 to 90wt.% monoester compd. (A) represented by formula I and/or II (wherein R₁ respresents H or a methyl group, R₂ represents H or a 1-4 C alkyl group, Y represents a 1-4 C alkylene group, or group represented by -(C_nH_2nO)_p-CH₂- (wherein n is an integer of 2 to 6 and p is an integer of 1 to 19), 0.01 to 20wt.% photopolymn. catalyst (B), and 5 to 40wt.% colorless rosin deriv. (C) having a Hazen color index of not more than 300 and obtd. by hydrogenating a purified rosin and/or colorless rosin deriv. having an acid value of 150 to 500 and a Hazen color index of not more than 300 and obtd. by subjecting an α,β-unsatd. monocarboxylic acid or dicarboxylic acid and a purified resin to an addition reaction and then conducting hydrogenation.;COPYRIGHT: (C)1997,JPO