首页> 外国专利> Method null of hole opening the standard hole of negative film for printed circuit board production

Method null of hole opening the standard hole of negative film for printed circuit board production

机译:开孔用于印刷电路板生产的底片标准孔的方法无效

摘要

PURPOSE: To provide a punching method wherein two holes are prevented from being different in a diameter from each other when the reference holes of two negative films for manufacturing a printed wiring board are simultaneously punched. ;CONSTITUTION: Two negative films 3 and 4 for manufacturing a printed wiring board and a soft sheet 5 are superposed together in a state that the soft sheet is arranged at the outside. The soft film 5 is placed on a punching device in such a way that the soft sheet 5 is arranged on the dice hole 7 side and a punch is pushed in the dice hole 7 to punch a hole.;COPYRIGHT: (C)1993,JPO&Japio
机译:目的:提供一种冲压方法,其中当同时冲压两个用于制造印刷线路板的负片的基准孔时,防止两个孔的直径彼此不同。组成:用于制造印刷线路板的两个负片3和4与软片5重叠在一起,并且软片位于外部。将软膜5放置在打孔装置上,使得将软片5布置在骰子孔7侧,并且将冲头推入骰子孔7以打孔。版权:(C)1993,日本特许厅

著录项

  • 公开/公告号JP3028676B2

    专利类型

  • 公开/公告日2000-04-04

    原文格式PDF

  • 申请/专利权人 日立化成工業株式会社;

    申请/专利号JP19920068259

  • 发明设计人 関口 弘;

    申请日1992-03-26

  • 分类号B26F1/02;

  • 国家 JP

  • 入库时间 2022-08-22 02:03:52

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号