Padding ink and its use manner null for copper plated through hole printed circuit board production

摘要

PURPOSE: To obtain an ink which does not undergo vol. shrinkage and has improved polymerizability and through-hole-protecting properties by incorporating a specific monoester compound a thermal polymerization catalyst and a photopolymerization catalyst into the ink. ;CONSTITUTION: This ink is prepd. by compounding 1-99wt.% monoester compd. represented by formula I or II [wherein R₁ is H or methyl; R₂ is H or 1-4C alkyl; and Y is alkylene or -(C_nH_2nO)_p-CH₂- (wherein n is 2-6; and p is 1-19)] and formed from a polycarboxylic acid and an alcohol having a vinylic unsatd. group, 0.01-20wt.% thermal polymn. catalyst, 0.01-20wt.% photopolymn. catalyst, and, if necessary, 5-90wt.% inert solid powder opaque to ultraviolet rays and up to 70wt.% at least one resin selected from among a phenol resin, a cresole resin, and a rosin resin having a softening point of 60°C or higher and an acid value of 50-500.;COPYRIGHT: (C)1995,JPO