Implemental manner of semiconductor equipment, implemental structure and electron-optical device null

摘要

PROBLEM TO BE SOLVED: To provide an inexpensive and reliable packaging structure of a tape carrier, and to provide an optoelectronic device.;SOLUTION: In the electric connection between the tape carrier and a circuit board, solder coating is applied to the outer lead of the tape carrier, thus performing the thermocompression bonding between the tape carrier and the circuit board. After the thermocompression bonding, the central section of the solder coating of the outer lead section is recessed so that the soldered quality can be confirmed easily and surely.;COPYRIGHT: (C)2002,JPO