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Implementation of overall equipment efficiency methodology in the semiconductor test facility ER: Equipment reliability and productivity improvement

机译:在半导体测试设施中实施整体设备效率方法论ER:设备可靠性和生产率提高

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The equipment efficiency plays a great role in the profitability of a manufacturing company. It impacts the throughput, cycle times, costs, and return on investment in manufacturing capacity. This article presents the implementation case study of an Overall Equipment Efficiency (OEE) metric and improvement methods in the semiconductor backend facility (Final Test and Sort). The case study will show an effective combination of a fully automated OEE measurement system, company-wide personnel training, and Lean Six Sigma tools to achieve a substantial improvement in factory output. The methodology includes four main components: 1. Systems development and implementation 2. Bottleneck (BN) management procedures 3. OEE improvement teams 4. Adjustment of the operations management procedures Supported by the OEE metric to manage and improve the BN performance, the facility increased its output, in less than eight weeks, by ∼18%.
机译:设备效率在制造公司的盈利能力中起着重要作用。它会影响吞吐量,周期时间,成本以及制造能力的投资回报率。本文介绍了半导体后端设施中的总体设备效率(OEE)度量标准和改进方法(最终测试和分类)的实施案例研究。该案例研究将显示出一套全自动OEE测量系统,全公司人员培训以及精益6西格玛工具的有效结合,从而实现了工厂产量的大幅提高。该方法包括四个主要部分:1.系统开发和实施2.瓶颈(BN)管理程序3. OEE改进团队4.调整运营管理程序在OEE度量标准的支持下,管理和改善BN绩效的设施有所增加在不到八周的时间里,其产出就增加了约18%。

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