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Implantation at elevated temperatures for amorphization re-crystallization of Si1-xGex films on silicon substrates
Implantation at elevated temperatures for amorphization re-crystallization of Si1-xGex films on silicon substrates
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机译:在高温下注入以使硅衬底上的Si1-xGex薄膜非晶化再结晶
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摘要
A method of fabricating a Si1-XGeX film on a silicon substrate includes preparing a silicon substrate; epitaxially depositing a Si1-XGeX layer on the silicon substrate forming a Si1-XGeX/Si interface there between; amorphizing the Si1-XGeX layer at a temperature greater than Tc to form an amorphous, graded SiGe layer; and annealing the structure at a temperature of between about 650° C. to 1100° C. for between about ten seconds and sixty minutes to recrystallize the SiGe layer.
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机译:一种在硅基板上制造Si 1-X Sub> Ge X Sub>膜的方法,包括制备硅基板;在硅衬底上外延沉积Si 1-X Sub> Ge X Sub>层,形成Si 1-X Sub> Ge X Sub> / Si接口之间;在高于T c Sub>的温度下非晶化Si 1-X Sub> Ge X Sub>层,以形成非晶的渐变SiGe层;并在约650℃的温度下对结构进行退火。 C.至1100°deg;在约十秒至六十分钟之间进行重结晶以使SiGe层重结晶。
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