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Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip
Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip
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机译:组装具有裸露的芯片背面且具有和不具有用于倒装芯片的散热器的封装的方法
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摘要
A method of assembling a package having an exposed die comprising the following steps. A die attached to a substrate by connectors is provided. The die having a backside. Encapsulate is formed around the die and over the backside of the die to form an encapsulated package. The encapsulate overlying the backside of the die and a portion of the backside of the die are removed using a backside exposure process to complete the assembled package having the die exposed.
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