Flip chip packaging process using laser-induced metal bonding technology, system utilizing the method, and device created by the method

摘要

Method for bonding a chip to a chip carrier including arranging the chip in alignment with the chip carrier to form a chip stack. First bond area situated on the chip at an interface between the chip and the chip carrier in contact with second bond area situated on the chip carrier at the interface. Projecting a laser beam through the chip and/or the chip carrier, the laser beam impinging on the first bond area and/or the second bond area melting the first bond area and/or the second bond area to form a bond electrically coupling the chip and the chip carrier. A device including a chip having a first bond area situated on a chip carrier side of the chip and a chip carrier having a second bond area situated on a chip side of the chip carrier. The first bond area is bonded to the second bond to form a contact area. The contact area less than about 40 &mgr;m². A system for bonding a chip to a chip carrier including a laser and an aperture for holding a chip stack in alignment. The chip stack includes a chip and a chip carrier. The laser is directed and/or focused by the aperture. The laser projects a laser beam through the chip and/or the chip carrier which impinges on the first bond area and/or the second bond area. The first bond area situated on a chip carrier side of the chip and the second bond area situated on a chip side of the chip carrier. The first bond area contacting the second bond area. The first bond area is bonded to the second bond area by the laser beam impinging on the first bond area and/or the second bond area.