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Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same
Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same
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机译:用于在倒装芯片封装工艺中增强粘附力的倒装芯片键合方法及其基板的金属层构建结构
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摘要
A flip chip bonding method and substrate architecture are disclosed for enhancing bonding performance between a chip and a substrate by forming a bump on the chip or the substrate. The flip chip bonding method includes performing pretreatment of a wafer having chips, dicing, and obtaining the pretreated individual chip; performing pretreatment of a substrate; aligning the pads of the pretreated chip with the pads of the pretreated substrate, and bonding the chip and the substrate together by applying an ultrasonic wave and heat using a collet and simultaneously applying pressure. Post treatment is performed by filling or molding resin after bonding. The chip or the substrate is formed with a plated bump, a stud bump or a wedge bump. The stud bump or the wedge bump can be additionally formed on the plated bump.
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