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Flip-chip ball grid array package for electromigration testing
Flip-chip ball grid array package for electromigration testing
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机译:倒装芯片球栅阵列封装,用于电迁移测试
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摘要
A test package for electromigration testing includes a die having a plurality of I/O pads formed on a metal layer, a plurality of traces formed on the die electrically connecting adjacent pairs of the I/O pads, a plurality of bumped interconnects formed on the I/O pads, and a substrate having a plurality of bump-to-bump interconnects formed on a top surface of the substrate adjacent to the die wherein the plurality of bump-to-bump interconnects is electrically coupled to the plurality of bumped interconnects so that the plurality of bumped interconnects is connected in series.
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机译:用于电迁移测试的测试封装包括:管芯,其具有在金属层上形成的多个I / O焊盘;在管芯上形成的多个迹线,将相邻的I / O焊盘对电连接;在其上形成的多个凸点互连。 I / O焊盘和具有在衬底的邻近管芯的顶表面上形成的多个凸点到凸点互连的衬底,其中多个凸点到凸点互连电耦合到多个凸点互连,因此多个凸起的互连是串联的。
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