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Reliability Evaluation of Solder Joints in Ball-Grid-Array-Type Packages by Impact Bending Test

机译：冲击弯曲试验的球栅阵列型包装中焊点的可靠性评估

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Akihiro YAGUCHI; Munehiro YAMADA; Kenichi YAMAMOTO;
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年度 2003
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1. Evaluation of Solder Joint Reliability in Flip-Chip Packages during Accelerated Testing [J] . JONG-WOONG KIM, DAE-GON KIM, WON SIK HONG, Journal of Electronic Materials . 2005,第12期

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2. Evaluation of solder joint reliability in flip chip package under thermal shock test [J] . Dae-Gon Kim, Jong-Woong Kim, Seung-Boo Jung Thin Solid Films . 2006,第1a2期

机译：热冲击试验下倒装芯片封装中焊点可靠性的评估
3. Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint [J] . Chao-Yang Mao, Rong-Sheng Chen Microelectronics reliability . 2008,第1期

机译：通过每个焊点的应变能密度（SED）的变化对双芯片堆叠封装的焊点可靠性进行包装参数分析和优化设计
4. Impact of Dwell Time on Solder Joint Reliability under Four Point Bend Testing [C] . Sandeep Menon, Michael Osterman IMAPS Advanced Technology Workshop on High Reliability Microelectronics for Military Applications . 2011

机译：停留时间对四点弯道测试下的焊点可靠性的影响
5. Reliability Assessment of Solder Joint Using BGA Package: Megtron 6 Versus FR4 Printed Circuit Boards Using Drop Testing [D] . Mundhe, Pradnya 2017

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6. Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints [O] . Jenn-Ming Song, Bo-Chang Huang, David Tarng, 2020

机译：界面金属间化合物层纳米力学响应与焊点冲击可靠性的关系
7. A Design Method for Estimating the Reliability of Lead Free Solder Joints in Ball-Grid-Array-Type Packages under Impact Load [O] . Akihiro YAGUCHI, Munehiro YAMADA, Kenichi YAMAMOTO 2003

机译：抗冲击载荷下球栅阵列型包装中无铅焊点可靠性的设计方法

Reliability Evaluation of Solder Joints in Ball-Grid-Array-Type Packages by Impact Bending Test

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