COPPER FOILS AND HIGH-DENSITY MULTILAYER PRINTED CIRCUIT BOARD USING THE COPPER FOILS FOR INNER-LAYER CIRCUIT

摘要

COPPER FOILS FOR USE IN AN INNER LAYER OF A HIGH-DENSITY MULTILAYER PRINTED CIRCUIT BOARD, WHICH HAVE BEEN TREATED TO FORM ELECTRODEPOSITED PROTRUSIONS ON THE GLOSSY SIDE AND FORM ON THEIR MATTE SIDE ELECTRODEPOSITED MICRO-PROTRUSIONS THAT ARE FINE AND UNIFORM: AND A HIGH-DENSITY MULTILAYER PRINTED CIRCUIT BOARD WHEREIN SAID COPPER FOILS SO TREATED ARE LAMINATED ON AN INNER-LAYER SUBSTRATE WITH THE GLOSSY SIDE OF THE COPPER FOILS FACING THERETO THEREBY TO FABRICATE AN INNER-LAYER CIRCUIT. ( FIG 4 )