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SOLDER FLUX COMPOSITIONS UNDERGOING PHASE SEPARATION DURING SOLDERING REFLOW PROCESS
SOLDER FLUX COMPOSITIONS UNDERGOING PHASE SEPARATION DURING SOLDERING REFLOW PROCESS
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机译:回流焊过程中进行相分离的焊剂成分
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摘要
A solder flux composition is provided which comprises active ingredients and a carrier. The solder flux composition undergoes a phase separation during solder reflow to form at least a first phase (21) and a second phase (23), such that the active ingredients are disposed primarily in the first phase and the carrier is disposed primarily in the second phase. The use of this solder flux composition is found to reduce solder migration, during solder reflow, that can result in bridging in ball grid arrays and other such devices.
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