A process for reflow - soldering in a steam phases vacuum soldering system

摘要

It is a method for a reflow - soldering in a vapour phase soldering apparatus with a continuous passage in the step operation or for a pure station operation presented. The parts to be soldered passes through a feed station for equipping, a drying station in a chamber closed by locks, the actual recipients, a cooling lock, and an unloading of the module, optionally, a cleaning module can be coupled directly. Dollars a the invention relates to a further development of the vapor phase soldering process, which is in the construction of the recipient shows. For the vacuum in a partially with an inert organic vapor. The recipient, the material to be soldered in the clocked continuous operation is supplied in a stepwise fashion. The good is to be soldered in the vapor phase by the boiling inert organic compound to temperatures above the melting point of the solder is heated and after the lifting of the parts to be soldered on zones above the vapor phase is a subsequent evacuation at temperatures above the solder melt is carried out.