LEAD-FREE BUMP AND METHOD FOR FORMING THE SAME

摘要

A lead-free bump which is formed by reflowing an Sn-Ag based solder alloy plating film having an adjusted Ag concentration; and a method for forming the lead-free bump, which comprises forming an Sn-Ag based alloy plating film having an Ag content lower than that at which Sn-Ag forms an eutectic by means of the metal plating method, and subjecting said alloy plating film to reflowing. The lead-free bump is characterized by containing a suppressed amount of voids.