TRANSFER METHOD, METHOD OF MANUFACTURING THIN FILM ELEMENT, METHOD OF MANUFACTURING INTEGRATED CIRCUIT, CIRCUIT SUBSTRATE AND METHOD OF MANUFACTURING THE CIRCUIT SUBSTRATE, ELECTRO-OPTIC DEVICE AND METHOD OF MANUFACTURING THE ELECTRO-OPTIC DEVICE, AND IC CARD AND ELECTRONIC EQUIPMENT

摘要

A transfer method comprising a step of forming a plurality of transferred bodies on a transfer origin substrate, and a step of applying energy to partial regions corresponding to the transferred bodies to be transferred, and transferring these transferred bodies corresponding to the partial regions onto a transfer destination substrate. A plurality of transferred bodies such as devices or circuits that are to be disposed on a transfer destination substrate with spaces therebetween can be manufactured integrated together on a transfer origin substrate, and hence compared with the case that the transferred bodies are formed on the transfer destination substrate directly, the amount of materials used in the manufacture of the transferred bodies can be reduced, the area efficiency can be greatly improved, and a transfer destination substrate on which a large number of devices or circuits are disposed in scattered locations can be manufactured efficiently and cheaply.