Transfer method, the method of manufacturing a thin-film device, method of manufacturing the integrated circuit, and a method of manufacturing the circuit board, and a method of manufacturing the electro-optical device, electronic equipment and IC card

摘要

A process of forming a plurality of transfer objects on a transfer source substrate, applying energy to a partial area corresponding to the transfer target to be transferred, and transferring the transfer object corresponding to the partial area to a transfer destination substrate And a transfer method. The transfer target such as a plurality of elements and circuits arranged at intervals on the transfer destination base can be integrated and manufactured on the transfer source base, so the transfer target is formed directly on the transfer destination base Compared to the case where the transfer material is used, the amount of material used to manufacture the transferred object is relatively reduced, the area efficiency is greatly improved, and the transfer destination substrate on which many elements and circuits are arranged in a distributed manner is efficiently and inexpensively. Can be manufactured.