首页> 外国专利> METHOD FOR FORMING STORAGE NODE CONTACT OF HOLE TYPE IN SEMICONDUCTOR DEVICE IMPROVING PROCESS MARGIN

METHOD FOR FORMING STORAGE NODE CONTACT OF HOLE TYPE IN SEMICONDUCTOR DEVICE IMPROVING PROCESS MARGIN

机译:改善过程边际的半导体装置中孔类型的存储节点接触的方法

摘要

PURPOSE: A method for forming a storage node contact is provided to improve SAC(Self-Aligned Contact) margin by forming the storage node contact with hole type instead of line type. CONSTITUTION: A first interlayer dielectric(2) having a poly plug is formed on a substrate(1). A conductive layer(4) and a nitride layer(5) as a hard mask are sequentially deposited on the first interlayer dielectric. By patterning the nitride layer and the conductive layer, bit lines(6) are formed. A second interlayer dielectric(7) and an anti-reflective coating are formed on the resultant structure. Contact holes(10) are formed to expose the poly plug. The remaining anti-reflective coating is removed. A spacer(11) is formed at both sidewalls of the contact holes. A storage node contact(12) of hole type is then formed by filling a polysilicon layer in the contact hole and by etch-back of the polysilicon layer.
机译:目的:提供了一种形成存储节点触点的方法,以通过以孔型而非线型形成存储节点触点来提高SAC(自对准触点)裕度。构成:具有聚栓的第一层间电介质(2)形成在基板(1)上。在第一层间电介质上依次沉积导电层(4)和作为硬掩模的氮化物层(5)。通过图案化氮化物层和导电层,形成位线(6)。在所得结构上形成第二层间电介质(7)和抗反射涂层。形成接触孔(10)以露出多晶硅塞。剩余的抗反射涂层被去除。在接触孔的两个侧壁上形成有垫片(11)。然后通过在接触孔中填充多晶硅层并通过回蚀多晶硅层来形成孔型的存储节点接触(12)。

著录项

  • 公开/公告号KR20040093556A

    专利类型

  • 公开/公告日2004-11-06

    原文格式PDF

  • 申请/专利权人 HYNIX SEMICONDUCTOR INC.;

    申请/专利号KR20030027471

  • 发明设计人 AHN HYEON;YOO JE HYEON;

    申请日2003-04-30

  • 分类号H01L21/28;

  • 国家 KR

  • 入库时间 2022-08-21 22:47:40

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