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Thermal stress absorbing interface structure and semiconductor assembly using the same and method for manufacturing the same
Thermal stress absorbing interface structure and semiconductor assembly using the same and method for manufacturing the same
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机译:吸收热应力的界面结构和使用该结构的半导体组件及其制造方法
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摘要
A thermal-stress-absorbing interface structure between a semiconductor integrated circuit chip and a surface-mount structure and a method for manufacturing the same. The thermal-stress-absorbing interface structure comprises an elongated conductive-bump pad having a first length-wise end and a second length-wise end, and a side. The thermal-stress-absorbing interface structure includes means for allowing the first end of the pad to move up when the second end of the pad moves down and alternately allowing the first end to move down when the second end moves up, upon thermal cycling. The means has a center axis and the up-and-down movements of the pad are balanced on the center axis. In accordance with this novel structure of the present invention, interconnection reliability such as solder joint reliability can be significantly improved.
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