Conductor structures and carrier substrates are formed by placing a metal film on a primary mold half, applying the second mould half, induction heating and moldings

摘要

Producing conductor structures and carrier substrates in injection mould technology, comprises placing a metal film (14) with an adhesive coating on one side, on a primary mould half (8) of an injection mould (32). The base has ribs and slats (10) which correspond to the conductor structures. The second mould half is then applied and the mould is closed, clamping the metal film in place. The film is heated by induction, and takes on the conductor shape. The conductors are covered during further injection stages. The injection moldings tool has at least two sections (30,31), and primary and secondary moulds are used to mold plastic components.