首页> 外国专利> GLASS CERAMIC COMPOSITION, GLASS CERAMIC SINTERED BODY AND MANUFACTURING METHOD FOR THE SAME, AND CIRCUIT BOARD AND THIN FILM CIRCUIT BOARD BOTH USING THE SAME

GLASS CERAMIC COMPOSITION, GLASS CERAMIC SINTERED BODY AND MANUFACTURING METHOD FOR THE SAME, AND CIRCUIT BOARD AND THIN FILM CIRCUIT BOARD BOTH USING THE SAME

机译:相同的玻璃陶瓷组成,玻璃陶瓷烧结体及其制造方法,以及使用该玻璃陶瓷烧结体的电路板和薄膜电路板

摘要

PROBLEM TO BE SOLVED: To obtain a glass ceramic composition capable of simultaneously firing together with a low resistant metal such as gold, silver and copper, and having a dielectric constant lower than alumina and also having high strengths and high dielectric constant and high Young's modulus characteristics and having lower dielectric constant and dielectric loss, to provide a glass ceramic sintered body and a manufacturing method therefor, and to provide a circuit board and a thin film circuit board both using the glass ceramic sintered body.;SOLUTION: A powdery mixture containing 35-80 mass% powdery glass containing at least 20-60 mass% SiO2, 2-30 mass% B2O3, 5-25 mass% Al2O3, 8-35 mass% MgO, 10-35 mass% BaO as essential components, and having an MgO/SiO2 mass ratio of 0.20-0.85, and also substantially containing no ZnO and TiO2 and 20-65 mass% powdery ceramic are burned at a low temperature of 1,000°C or less.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:获得一种玻璃陶瓷组合物,该玻璃陶瓷组合物能够与诸如金,银和铜的低电阻金属同时烧制,并且介电常数低于氧化铝,并且还具有高强度,高介电常数和高杨氏模量具有低介电常数和介电损耗的特性,以提供一种玻璃陶瓷烧结体及其制造方法,并提供使用该玻璃陶瓷烧结体的电路板和薄膜电路板。 35-80质量%的粉状玻璃,其含量至少为20-60质量%SiO 2 ,2-30质量%B 2 O 3 ,5 -25质量%的Al 2 O 3 ,8-35质量%的MgO,10-35质量%的BaO作为基本成分,并且具有MgO / SiO 2 的质量比为0.20-0.85,并且基本上不包含ZnO和TiO 2 ,并且在1,000&d的低温下燃烧20-65质量%的粉末陶瓷例如; C或以下。;版权:(C)2006,JPO&NCIPI

著录项

  • 公开/公告号JP2005306714A

    专利类型

  • 公开/公告日2005-11-04

    原文格式PDF

  • 申请/专利权人 KYOCERA CORP;

    申请/专利号JP20040312156

  • 发明设计人 KAWAI SHINYA;

    申请日2004-10-27

  • 分类号C04B35/16;C04B35/495;H01B3/02;H05K1/03;H05K3/46;

  • 国家 JP

  • 入库时间 2022-08-21 22:35:03

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