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GLASS CERAMIC COMPOSITION, GLASS CERAMIC SINTERED BODY AND MANUFACTURING METHOD FOR THE SAME, AND CIRCUIT BOARD AND THIN FILM CIRCUIT BOARD BOTH USING THE SAME
GLASS CERAMIC COMPOSITION, GLASS CERAMIC SINTERED BODY AND MANUFACTURING METHOD FOR THE SAME, AND CIRCUIT BOARD AND THIN FILM CIRCUIT BOARD BOTH USING THE SAME
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机译:相同的玻璃陶瓷组成,玻璃陶瓷烧结体及其制造方法,以及使用该玻璃陶瓷烧结体的电路板和薄膜电路板
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摘要
PROBLEM TO BE SOLVED: To obtain a glass ceramic composition capable of simultaneously firing together with a low resistant metal such as gold, silver and copper, and having a dielectric constant lower than alumina and also having high strengths and high dielectric constant and high Young's modulus characteristics and having lower dielectric constant and dielectric loss, to provide a glass ceramic sintered body and a manufacturing method therefor, and to provide a circuit board and a thin film circuit board both using the glass ceramic sintered body.;SOLUTION: A powdery mixture containing 35-80 mass% powdery glass containing at least 20-60 mass% SiO2, 2-30 mass% B2O3, 5-25 mass% Al2O3, 8-35 mass% MgO, 10-35 mass% BaO as essential components, and having an MgO/SiO2 mass ratio of 0.20-0.85, and also substantially containing no ZnO and TiO2 and 20-65 mass% powdery ceramic are burned at a low temperature of 1,000°C or less.;COPYRIGHT: (C)2006,JPO&NCIPI
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