首页> 外国专利> CRYSTALLIZED GLASS COMPOSITION FOR CIRCUIT BOARD, CRYSTALLIZED GLASS SINTERED BODY, INSULATOR COMPOSITION, INSULATING PASTE AND THICK FILM CIRCUIT BOARD

CRYSTALLIZED GLASS COMPOSITION FOR CIRCUIT BOARD, CRYSTALLIZED GLASS SINTERED BODY, INSULATOR COMPOSITION, INSULATING PASTE AND THICK FILM CIRCUIT BOARD

机译:电路板的结晶玻璃成分,烧结玻璃的晶体,绝缘体成分,绝缘膏和厚膜电路板

摘要

PURPOSE: A crystallized glass composition is to have a property suitable for electric insulating material for circuit board, which is sinterable below the temperature of 1100 deg.C and has a specific dielectricity of less than 12 and a thermal expansion coefficient of more than 12 ppm/deg.C. CONSTITUTION: A glass composition comprises SiO2, MgO and CaO whose composition ratio expressed in weight percent lies in an area surrounded by a line connecting a point A(25,45,30), a point B(25,0,75) a point C(44,0,56) a point D(44,22,34) a point E(40,19,41) and a point F(29,40,31) in a ternary phase diagram thereof. By heat treating the composition, at least one species of crystalline phase of melwinite(Ca3MgSi2O8), monticellite(CaMgSiO4) and calcium silicate(at least one of CaSiO3, Ca3Si2O7, Ca2SiO4 and Ca3SiO5) is deposited. A ceramic composition having a thermal expansion coefficient of more than 6.0 ppm/deg.C is added to the powder composed of the glass composition.
机译:用途:结晶玻璃组合物应具有适用于电路板电绝缘材料的特性,该特性可在1100℃以下的温度下烧结,比介电常数小于12,热膨胀系数大于12 ppm /℃组成:一种玻璃组合物,包含SiO2,MgO和CaO,其组成比以重量百分比表示位于由连接点A(25,45,30),点B(25,0,75)和点A C(44,0,56)在其三元相图中的点D(44,22,34),点E(40,19,41)和点F(29,40,31)。通过对该组合物进行热处理,沉积了至少一种结晶相的白云母(Ca3MgSi2O8),蒙脱石(CaMgSiO4)和硅酸钙(CaSiO3,Ca3Si2O7,Ca2SiO4和Ca3SiO5中的至少一种)。将具有大于6.0ppm /℃的热膨胀系数的陶瓷组合物添加到由玻璃组合物组成的粉末中。

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