首页> 外国专利> Crystalline glass composition for use in circuit board sintered crystalline glass insulator composition insulating paste and thick film circuit board

Crystalline glass composition for use in circuit board sintered crystalline glass insulator composition insulating paste and thick film circuit board

机译:用于电路板的结晶玻璃组合物烧结结晶玻璃绝缘子组合物绝缘膏和厚膜电路板

摘要

That the present invention is sintered at a temperature not higher than 1100 ℃, and the relative dielectric constant of the service 12 or less, the crystallized glass composition for a circuit board having a preferred characteristic as an electrical insulating material for the thermal expansion coefficient is 12ppm / ℃ or more, a circuit board, glass composition for a circuit board according to the present invention, SiO 2, MgO, above which includes CaO, expressed as a weight% SiO 2, MgO, that the composition ratio of CaO, 3-component phase diagram of Figure 1 a (25, 45, 30), point B (25, 0, 75), point C (44, 0, 56), point D (44, 22, 34), point E (40, 19, 41) and point F (29, 40, 31) is within the connecting surrounded by a line area, by heat-treating the composition, melwi nitro, Monticello light and calcium is adapted to separate out at least a crystal phase of one kind of silicate, the thermal expansion coefficient of the powder formed of the glass composition 6.0 there happened the addition of the ceramic powder over ppm / ℃.
机译:本发明是在不高于1100℃的温度下进行的,并且服务的相对介电常数在12以下,因此,作为用于热膨胀系数的电绝缘材料具有优选特性的用于电路板的微晶玻璃组合物为: 12ppm /℃或更高,电路板,根据本发明的用于电路板的玻璃组合物,SiO 2, MgO,其中包括CaO,以SiO% 2的重量%表示, MgO,即CaO的组成比,图1a(25、45、30),B点(25、0、75),C点(44、0、56)的3组分相图, D点(44、22、34),E点(40、19、41)和F点(29、40、31)在由线区域围绕的连接区域内,通过热处理组合物melwi nitro,Monticello光和钙适于分离出至少一种硅酸盐的晶相,该玻璃组合物形成的粉末的热膨胀系数6.0时,发生了超过ppm /℃的陶瓷粉末的添加。

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