LEAD-FREE SnAgCu SOLDER ALLOY

摘要

PROBLEM TO BE SOLVED: To provide lead-free SnAgCu solder alloy with Cu erosion resistance and oxidation resistance.;SOLUTION: The solder alloy has the composition consisting of, by weight, 0.2-2.0% Cu, 1.0-5.0% Ag, 0.05-0.03% Co, 0.005-0.03% Ge, and the balance Sn, and Cu elution is suppressed, and production of oxides is reduced.;COPYRIGHT: (C)2005,JPO&NCIPI