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METHOD FOR MANUFACTURING N-TYPE SEMICONDUCTOR DIAMOND AND N-TYPE SEMICONDUCTOR DIAMOND

机译:N型半导体钻石和N型半导体钻石的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a low resistance n-type semiconductor diamond containing lithium and nitrogen and the n-type semiconductor diamond.;SOLUTION: The method for manufacturing the n-type semiconductor diamond comprises preparing a diamond containing Li and N by ion-implanting Li to a diamond single crystal containing N in an amount of ≥10 ppm so that the concentration of Li becomes ≥10 ppm or by ion-implanting Li and N to a diamond single crystal so that the depths of ion-implanting, where the concentrations of Li and N are each ≥10 ppm after ion-implanting, overlap when Li and N are ion-implanted to the diamond, and performing electrical activation of Li and N and recovering the crystal structure of the diamond by heat-treating the diamond within a temperature range of ≥800 and 1,800°C. The n-type semiconductor diamond contains Li and N in an amount of ≥10 ppm, respectively, at the same depth from the crystal surface and has a sheet resistance of ≤107Ω/square.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:提供一种用于制造包含锂和氮的低电阻n型半导体金刚石的方法以及该n型半导体金刚石。通过将Li离子注入到含有≥10ppm的N的金刚石单晶中以使Li的浓度变为≥10ppm或通过将Li和N离子注入到金刚石单晶中以使其深度达到离子注入后,Li和N的浓度分别为离子注入后的10ppm以上;当Li和N离子注入到金刚石中时,Li和N的浓度重叠,并进行Li和N的电活化并恢复其晶体结构。通过在〜800℃和<1,800℃的温度范围内对金刚石进行热处理。 n型半导体金刚石在距晶体表面相同的深度处分别包含含量为10geppm的Li和N,并且薄层电阻为≤10 7 Ω/ square 。;版权:(C)2005,JPO&NCIPI

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