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METHOD OF MANUFACTURING N-TYPE SEMICONDUCTOR DIAMOND, AND N-TYPE SEMICONDUCTOR DIAMOND

机译:N型半导体钻石的制造方法以及N型半导体钻石

摘要

A method of manufacturing n-type semiconductor diamond by thepresent invention is characterized in producing diamond incorporating Li andN by implanting Li ions into, so that 10 ppm thereof will be contained in,single-crystal diamond incorporating 10 ppm or more N, or else, in dopingsingle-crystal diamond with Li and N ions, by implanting the ions so thation-implantation depths at which the post-implantation Li and Nconcentrations each are 10 ppm or more will overlap, and thereafter annealingthe diamond in a temperature range of from 800°C or more to less than1800°Cto electrically activate the Li and N and restore the diamond crystallinestructure. In the present invention, n-type semiconductor diamondincorporates,from the surface of the crystal to the same depth, 10 ppm or more of each ofLiand N, wherein its sheet resistance is 10 7 .OMEGA./~ or less.
机译:通过该方法制造n型半导体金刚石的方法本发明的特征在于生产掺有Li和Al的金刚石。通过将Li离子注入到N中,使其包含在其中的10 ppm,掺入10 ppm或更多N的单晶金刚石植入锂离子和锂离子的单晶金刚石注入后Li和N的离子注入深度浓度均为10 ppm或更高的浓度会重叠,然后退火钻石的温度范围为800°C以上至以下1800°摄氏度电激活Li和N并恢复金刚石晶体结构体。在本发明中,n型半导体金刚石合并,从晶体的表面到相同的深度,每一个的10 ppm或更多里N和N,其中薄层电阻为10 7Ω/□或更小。

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