PROBLEM TO BE SOLVED: To realize high density and low profile by incorporating an electric double layer capacitor in a substrate.;SOLUTION: The substrate 100a incorporating an electric double layer capacitor comprises a planar electric double layer capacitor 110 having electrode surfaces 114a and 115a opposing each other and a side face, a core layer 120 incorporating the electric double layer capacitor 110, a power supply wiring pattern 121 formed on one major surface 120a of the core layer 120, a ground wiring pattern 122 formed on the other major surface 120b of the core layer 120, a via hole electrode 131 for connecting the electrode surface 114a and the power supply wiring pattern 121 through a via hole formed on the major surface 120a side of the core layer 120, and a via hole electrode 132 for connecting the electrode surface 115a and the ground wiring pattern 122 through a via hole formed on the major surface 120b side of the core layer 120.;COPYRIGHT: (C)2005,JPO&NCIPI
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