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Preferential via exit structures with triad configuration for printed circuit boards

机译:具有三合一配置的优先通孔出口结构,用于印刷电路板

摘要

A circuit board design is disclosed that is useful in high-speed differential signal applications uses either a via arrangement or a circuit trace exit structure. A pair of differential signal vias in a circuit board are surrounded by an opening that is formed within a ground plane disposed on another layer of the circuit board. The vias are connected to traces on the circuit board by way of an exit structure that includes two flag portions and associated angled portions that connect the flag portions to circuit board traces. In an alternate embodiment, the circuit board traces that leave the differential signal vias are disposed in one layer of the circuit board above a wide ground strip disposed on another layer of the circuit board.
机译:公开了一种电路板设计,其使用通孔布置或电路迹线出口结构在高速差分信号应用中有用。电路板中的一对差分信号通孔被形成在布置在电路板另一层上的接地平面内的开口围绕。通孔通过出口结构连接到电路板上的走线,该出口结构包括两个标记部分和将标记部分连接到电路板走线的相关角度部分。在一个替代实施例中,离开差分信号通孔的电路板迹线被布置在电路板的一层中,在布置在电路板的另一层上的宽接地带上方。

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