TURNING PRINTED CIRCUIT BOARDS INTO PRINTED CIRCUIT STRUCTURES USING 3D PRINTING

摘要

Tightly packaged circuits are utilizing such approaches as multi-chip modules or multi-layer printed circuit boards to obtain more function per volume. This has been effective, but the need for more functions continue to grow many of which are wireless. The wireless electronics are challenging given the cross talk and interference issues, this is remedied utilizing shielding and designed spacing, but this is just part of the challenge. Each of these RF electronic devices require an antenna and the antenna size is controlled by frequency. Lower frequencies require larger antennas and this an issue for space limited structures. More active and passive components coupled with more antennas on a single device has elevated the challenge for electronic packaging. Antennas used to be a separate issue and the packaging part was to minimize the cabling to the antenna. With multiple antennas and the supporting lumped elements, traditional packaging methods are no longer practical. This paper will demonstrate the transition from Printed Circuit Boards (PCB) to Printed Circuit Structures (PCS). PCS are fabricated using a combined 3D printing and Printed Electronics approach. This approach allows for a unique structural build with printed electronic materials as part of that structure, but it also allows for printed antennas to become part of that structural build. This will lead to the reduction or elimination of the PCB since the electronics will be reshaped, reformed and become structure.