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Land grid array connector and method of assembling an IC chip therein

机译:焊盘栅格阵列连接器及其中组装IC芯片的方法

摘要

A land array grid (LGA) connector and a method for assembling an IC chip into the LGA connector is provided. The LGA connector comprises an insulative housing (1) having a plurality of electrical terminals (2) received therein, a reinforcement plate (3) surrounding the insulative housing, a load plate (4) and a lever (5) pivotally connected to a same end of the reinforcement plate. The load plate and the lever rotate with respect to the reinforcement plate between an open position and a closed position; and the lever pushes the load plate to move from a middle position to the closed position during the lever rotates from the opening position to the closed position such that a free end of the load plate engages with the reinforcement plate.
机译:提供了一种焊盘阵列栅格(LGA)连接器以及用于将IC芯片组装到LGA连接器中的方法。 LGA连接器包括一个绝缘壳体( 1 ),绝缘壳体( 1 )容纳在其中,多个电端子( 2 )以及包围其中的加强板( 3 )绝缘外壳,一个负载板( 4 )和一个杠杆( 5 )可枢转地连接到增强板的同一端。负载板和杠杆相对于加强板在打开位置和关闭位置之间旋转;在杆从打开位置旋转到关闭位置的过程中,杆推动负载板从中间位置移动到关闭位置,从而使负载板的自由端与加强板接合。

著录项

  • 公开/公告号US6957973B1

    专利类型

  • 公开/公告日2005-10-25

    原文格式PDF

  • 申请/专利权人 ROBERT G. MCHUGH;HAO-YUN MA;

    申请/专利号US20050055412

  • 发明设计人 ROBERT G. MCHUGH;HAO-YUN MA;

    申请日2005-02-09

  • 分类号H01R13/62;

  • 国家 US

  • 入库时间 2022-08-21 22:20:44

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