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Contactless optical probe for use in semiconductor processing metrology
Contactless optical probe for use in semiconductor processing metrology
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机译:非接触式光学探针,用于半导体加工计量
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摘要
A method and/or device (285) for determining first and second band offsets (100, 110) at a semiconductor/dielectric heterointerface (115), which includes the semiconductor/dielectric heterointerface (115) exposed to incident photons (205) from a light source (200); a detector (275, 280) for generating a signal by detecting emitted photons (260, 265) from the semiconductor/dielectric heterointerface (115); and an element (310) for changing the energy of incident photons (205) to monitor the first and second band offsets (100, 110).
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