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Method for measuring process parameters of a semiconductor fabrication process using the optical metrology

机译:使用光学计量技术测量半导体制造工艺的工艺参数的方法

摘要

PROBLEM TO BE SOLVED: To provide a method of measuring a process parameter of a semiconductor fabrication process using an optical measurement.;SOLUTION: The fabrication process is performed on a first area using a first value of the process parameter. The fabrication process is next performed on a second area using a second value of the process parameter. Second measurements of the first and the second area are performed using an optical measuring device. One or more optical characteristics of the first area are determined based on the first measurement. One or more optical characteristics of the second area are determined based on the second measurement. The fabrication process is performed on a third area. A third measurement of the third area is performed using the optical measuring device. A third value of the process parameter is determined on the basis of the third measurement and a relation between the determined optical characteristics of the first area and the determined optical characteristics of the second area.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:提供一种使用光学测量来测量半导体制造工艺的工艺参数的方法。解决方案:使用工艺参数的第一值在第一区域上执行制造工艺。接下来,使用工艺参数的第二值在第二区域上执行制造工艺。使用光学测量装置执行第一和第二区域的第二测量。基于第一测量确定第一区域的一个或多个光学特性。基于第二测量来确定第二区域的一个或多个光学特性。制造过程在第三区域上执行。使用光学测量装置执行第三区域的第三测量。根据第三次测量以及所确定的第一区域的光学特性与所确定的第二区域的光学特性之间的关系来确定过程参数的第三值。版权所有:(C)2008,JPO&INPIT

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