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Method of forming the integrated circuit having a die with high Q inductors and capacitors attached to a die with a circuit as a flip chip
Method of forming the integrated circuit having a die with high Q inductors and capacitors attached to a die with a circuit as a flip chip
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机译:形成具有裸片的集成电路的方法,该裸片具有通过电路作为倒装芯片而附接至裸片的高Q电感器和电容器
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摘要
A semiconductor integrated circuit with high Q inductors and capacitors is disclosed. A semiconductor electrical circuit is formed on a first die, while micro-electromechanical structures having inductance and capacitance are formed on a second die. The second die is attached and electrically connected to the first die as a flip chip.
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