HEAT SPREADERS, HEAT SPREADER PACKAGES, AND FABRICATION METHODS FOR USE WITH FLIP CHIP SEMICONDUCTOR DEVICES

摘要

ABSTRACT HEAT SPREADERS, HEAT SPREADER PACKAGES, AND FABRICATIONMETHODS FOR USE WITH FLIP CHIP SEMICONDUCTOR DEVICESA method for fabricating a semiconductor device heat spreader 400, , 6, 00, 1100, 1800, 2209, 2500, 37005100] from a unitary piece of metallic material[ 02, 5,102; 314; '; 312, 224)2-, 7. 0 l The metallic material [M2, 5102; 311. 31_, 220is stamped 2 2 2.5021[5 to form a unitary heat spreader ,. 400, 500, 600, 1400, , 2200, 2500, 3700, "having an upper heat dissipation region [3 52], a lower substrate contact region 2202, 221, and supports { connecting the upper heat dissipation region [: 02,510202_' and the lower substrate contact region [.3 12, 2202, 2552j. A recess [ is formed within the supports [3141 and the upper and lower regions 5102] fez, 9,202, 21 for receiving a semiconductor device. (Fig. 3)