METHOD FOR FORMING THICK FILM PATTERN, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND PHOTOSENSITIVE PASTE FOR PHOTOLITHOGRAPHY

摘要

Disclosed is a method for forming a thick film pattern which enables to form a thick film pattern which has a large thickness, high hardness and high aspect ratio with high dimensional precision and high shape precision. Also disclosed are a method for manufacturing an electronic component wherein such a method for forming a thick film pattern is used, and a photosensitive paste for photolithography which is used in formation of a thick film pattern by a photolithography method. A photosensitive paste containing an inorganic powder, a photosensitive monomer and a photopolymerization initiator but substantially not containing a polymer is applied to a supporting body, thereby forming a photosensitive paste film thereon. After being subjected to an exposure treatment, this photosensitive paste film is developed, thereby forming a certain thick film pattern. A photosensitive paste containing an inorganic powder, a photosensitive monomer, a photopolymerization initiator and a polymer is also used wherein the ratio (weight ratio) of the photosensitive monomer to the total amount of the photosensitive monomer and the polymer is not less than 0.86.