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A method for fabricating a storage capacitor and a semiconductor component fabricated by using a storage capacitor based on the same method
A method for fabricating a storage capacitor and a semiconductor component fabricated by using a storage capacitor based on the same method
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机译:一种存储电容器的制造方法和基于该方法的使用存储电容器制造的半导体元件
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摘要
Production of a storage capacitor comprises preparing a first electrode layer (1); applying a 1 nm thick CeO2 layer (2) on the electrode layer; applying an amorphous dielectric layer (3) made from SrBi2Ta2O9 (SBT) or SrBi2(TaNb)2O9 (SBTN) on the CeO2 layer; heating at 590-620[deg] C to crystallize the dielectric layer; and applying a second electrode layer (4) on the dielectric layer. An independent claim is also included for a process for the production of a semiconductor component comprising forming a switching transistor on a semiconductor substrate; and forming the storage capacitor on the transistor. Preferred Features: The electrode layers are made from platinum, a conducting oxide of a platinum or an inert and conducting oxide. The dielectric layer is 20-200 nm thick.
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机译:存储电容器的制造包括准备第一电极层(1);以及准备第一电极层(1)。在电极层上施加1 nm厚的CeO2层(2);在CeO 2层上施加由SrBi 2 Ta 2 O 9(SBT)或SrBi 2(TaNb)2 O 9(SBTN)制成的非晶介电层(3);在590-620℃加热以使介电层结晶。在介电层上施加第二电极层(4)。还包括用于制造半导体部件的方法的独立权利要求,该方法包括在半导体衬底上形成开关晶体管;在晶体管上形成存储电容器。优选特征:电极层由铂,铂的导电氧化物或惰性和导电氧化物制成。介电层的厚度为20-200 nm。
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