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Method of fabricating semiconductor device having storage capacitor and higher voltage resistance capacitor and semiconductor device fabricated using the same

机译:具有存储电容器和更高耐压电容器的半导体器件的制造方法以及使用其制造的半导体器件

摘要

Provided are a method of fabricating a semiconductor device having different kinds of capacitors, and a semiconductor device formed using the same. In a fabrication process, after preparing a substrate including a storage capacitor region and a higher voltage resistance capacitor region, a lower electrode layer may be formed on the storage capacitor region and the higher voltage resistance capacitor region. A first dielectric film may be formed on the lower electrode layer, and the first dielectric film of the storage capacitor region may be selectively removed to expose the lower electrode layer of the storage capacitor region. After forming a second dielectric film on the first dielectric film and the exposed lower electrode layer of the storage capacitor region, an upper electrode layer may be formed on the second dielectric film.
机译:提供一种制造具有不同种类的电容器的半导体器件的方法,以及使用该方法形成的半导体器件。在制造过程中,在准备包括存储电容器区域和较高耐压电容器区域的基板之后,可以在存储电容器区域和较高耐压电容器区域上形成下部电极层。可以在下电极层上形成第一电介质膜,并且可以选择性地去除存储电容器区的第一电介质膜以暴露存储电容器区的下电极层。在第一介电膜和存储电容器区域的暴露的下部电极层上形成第二介电膜之后,可以在第二介电膜上形成上部电极层。

著录项

  • 公开/公告号US8507967B2

    专利类型

  • 公开/公告日2013-08-13

    原文格式PDF

  • 申请/专利权人 HWA-SOOK SHIN;

    申请/专利号US20090320626

  • 发明设计人 HWA-SOOK SHIN;

    申请日2009-01-30

  • 分类号H01L27/108;

  • 国家 US

  • 入库时间 2022-08-21 16:48:26

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