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A Study on the Method to Embed the Thin Film Capacitor Fabricated by Semiconductor Technology

机译：嵌入半导体技术制造的薄膜电容器方法的研究

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Mitsuhiro WATANABE; Ichiro KOIWA; Hideo HONMA; Kinya ASHIKAGA; Makoto TERUI; Yasushi SHIRAISHI; Noritaka ANZAI; Takashi OHSUMI; Tetsuya OSAKA; Tomoya KUMAGAI; Yoshimi SATO; Akira HASHIMOTO;
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1. Patent Issued for Thin-Film Capacitor Structures Embedded in Semiconductor Packages and Methods of Making [J] . Journal of Engineering . 2013,第12期

机译：嵌入半导体封装的薄膜电容器结构及其制造方法已获专利
2. Mechanical stress effects on Pb(Zr, Ti)O_3 thin-film ferroelectric capacitors embedded in a standard complementary metal-oxide-semiconductor process [J] . Antonio G. Acosta, John A. Rodriguez, Toshikazu Nishida Applied Physics Letters . 2014,第22期

机译：机械应力对嵌入标准互补金属氧化物半导体工艺中的Pb（Zr，Ti）O_3薄膜铁电电容器的影响
3. Possibility of BaTiO3 thin films prepared on Cu substrates for embedded decou- pling capacitors by an aerosol deposition method [J] . Jong-Min OH, Song-Min NAM Journal of Ceramic Processing Research. (Text in English) . 2009,第5期

机译：通过气溶胶沉积法在铜衬底上制备嵌入式去耦电容器的BaTiO3薄膜的可能性
4. High energy density capacitors fabricated by thin film technology [C] . Andrew V. Wagner, Gary W. Johnson, Troy W. Barbee Jr Symposium on multicomponent oxide films for electronics . 1999

机译：由薄膜技术制造的高能量密度电容器
5. Ultra-thin ceramic films for low-temperature embedding of decoupling capacitors into organic printed wiring boards. [D] . Balaraman, Devarajan. 2005

机译：超薄陶瓷膜，用于将去耦电容器低温嵌入到有机印刷电路板中。
6. Wearable 1 V operating thin-film transistors with solution-processed metal-oxide semiconductor and dielectric films fabricated by deep ultra-violet photo annealing at low temperature [O] . Byoung-Soo Yu, Jun-Young Jeon, Byeong-Cheol Kang, -1

机译：具有固溶处理的金属氧化物半导体和介电膜的可穿戴式1 V工作薄膜晶体管通过低温深紫外光退火在低温下制成
7. High Energy Density Capacitors Fabricated by Thin Film Technology [O] . Andrew V. Wagner, Gary W. Johnson, Troy W. Barbee 1999

机译：由薄膜技术制造的高能量密度电容器

A Study on the Method to Embed the Thin Film Capacitor Fabricated by Semiconductor Technology

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