POLISHING HEAD OF CMP APPARATUS TO IMPROVE POLISHING UNIFORMITY OF WAFER AND PREVENT WAFER FROM BEING BROKEN

摘要

PURPOSE: A polishing head of a CMP(chemical mechanical polishing) apparatus is provided to improve polishing uniformity of a wafer and prevent a wafer from being broken by arranging vacuum holes according to a wafer type. CONSTITUTION: A polishing head(200) of a CMP apparatus absorbs and pressurizes a wafer(100) by using vacuum. A plurality of vacuum holes(200a) are arranged according to a wafer type on the lower surface of the polishing head, separated from each other by a predetermined interval. The interval between the corner part of the wafer and the plurality of vacuum holes is uniformly maintained.