HANDLER BLADE OF WAFER TRANSFER ROBOT FOR PREVENTING GENERATION OF BROKEN WAFER IN PROCESS FOR LOADING OR UNLOADING WAFER

• 1. 用于晶圆切片的等离子体刻蚀装置及其装载、卸载晶圆的方法 [P] . 中国专利： CN105789013B . 2017.09.19
• 2. 用于晶圆切片的等离子体刻蚀装置及其装载、卸载晶圆的方法 [P] . 中国专利： CN105789013A . 2016-07-20
• 3. METHOD FOR TRANSFERRING A WAFER USING A WAFER TRANSFER ROBOT CAPABLE OF INCREASING THE EFFICIENCY OF A LOADING/UNLOADING PROCESS OF A WAFER [P] . 韩国专利： KR20120011201A . 2012-02-07

  机译： 利用能够提高晶片的装卸过程效率的晶片传递机器人来传递晶片的方法

• 4. ROBOT FORK FOR TRANSFERRING WAFER HAVING WAFER SLIDING DETECTION SENSOR TO PREVENT DAMAGE OF WAFER IN WAFER TRANSFER PROCESS [P] . 韩国专利： KR20050024825A . 2005-03-11

  机译： 用于转移晶片的机器人前叉具有晶片滑动检测传感器以防止晶片转移过程中晶片的损坏

• 5. WAFER CHIPPING DETECTING SYSTEM TO PREVENT WAFER FROM BEING BROKEN BY CHIPPING OF WAFER PRIOR TO ETCH PROCESS AND DISCOVER WAFER TO BE BROKEN [P] . 韩国专利： KR20050017718A . 2005-02-23

  机译： 晶片加工检测系统可防止晶片在蚀刻过程之前因晶片切割而破裂，并发现晶片断裂

• 1. Study on precision dicing process of SiC wafer with diamond dicing blades [J] . Xue Wang, Zewei Yuan, Peng Zhuang, 纳米技术与精密工程（英文） . 2021,第003期
• 2. Challenges in Processing Diamond Wire Cut and Black Silicon Wafers in Large-Scale Manufacturing of High Efficiency Solar Cells [J] . Kishan Shetty, Yudhbir Kaushal, Nagesh Chikkan, 电力能源（英文） . 2020,第002期
• 3. Development of vibration suppression GUI tool based input preshaping control and its applications to wafer transfer robot and gantry loader systems [C] . Minh Duc Duong, Terashima Kazuhiko European Control Conference . 2009
• 4. Pad-wafer and brush-wafer contact characterization in planarization and post-planarization processes. [D] . Sun, Ting. 2009
• 5. Effect of Au Film Thickness and Surface Roughness on Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing by Au-Au Surface Activated Bonding [O] . Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, 2020
• 6. Wafer FTIR - Measuring Interstitial Oxygen on as Cut and Processed Silicon Wafers [O] . Wolny Franziska, Krause Andreas, Oehlke Alexander, 2016

• 1. A review of silicon-based wafer bonding processes,an approach to realize the monolithic integration of Si-CMOS and III-V-on-Si wafers [J] . Shuyu Bao ,Yue Wang ,Khaw Lina . 半导体学报：英文版 . 2021,第2期
• 2. Study on precision dicing process of SiC wafer with diamond dicing blades [J] . Xue Wang ,Zewei Yuan ,Peng Zhuang . 纳米技术与精密工程 . 2021,第003期
• 3. Design and Analysis of the Power Drive Module for Ultrahigh Vacuum Wafer-Transfer Robot [J] . H.C. Chen ,S.M. Huang . 能源与动力工程 . 2010,第006期
• 4. 整晶圆IGBT芯片及其全压接平板式封装技术研究 [C] . ZENG Zhong ,曾重 ,LIU Yanlan . 第十一届中国高校电力电子与电力传动学术年会 . 2017
• 5. 晶圆传输机器人末端运动及晶圆接触状态检测系统研究 [A] . 李康 . 2013