WAFER CHIPPING DETECTING SYSTEM TO PREVENT WAFER FROM BEING BROKEN BY CHIPPING OF WAFER PRIOR TO ETCH PROCESS AND DISCOVER WAFER TO BE BROKEN

摘要

PURPOSE: A wafer chipping detecting system is provided to prevent a wafer from being broken by chipping of a wafer prior to an etch process and discover a wafer to be broken by additionally installing an apparatus capable of detecting chipping of the edge of the wafer in an orient chamber. CONSTITUTION: Equipment includes an inspection portion for inspecting whether chipping(30) exists in a wafer and a wafer aligning portion. The equipment that inspects whether the chipping exists in the wafer uses a laser beam. The inspection of the chipping of the wafer detects a roughness variation of the wafer caused by a laser beam.