Semiconductor bar scribing/cutting method, involves removing saw/scribing base by immersion in purification bath

摘要

A method for scribing a semiconductor rod/bar, in which the wafer(s) are scribed/sawn and then the individual wafers are orientated so that the position of the saw base/support is determined, in which the saw base/support establishes the outlet point of the scribing/sawing process and the opposite lying inlet point is defined. The two peripheral points are determined and the furthest is determined as the center point, the thickness is measured and these measurement points are passed to a computer of the sawing machine as the results for thickness correction. The discs are finally immersed in a purification bath, preferably an ultrasound bath, to particularly remove the saw/scribing base.