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Radiation emitting and/or radiation receiving semiconductor element with a semiconductor chip useful in LED technology, and in reaction-flow processes and surface mounting technology (SMT)

机译:具有在LED技术,反应流工艺和表面安装技术(SMT)中有用的半导体芯片的辐射发射和/或辐射接收半导体元件

摘要

Radiation emitting and/or radiation receiving semiconductor element with a radiation emitting and/or radiation receiving semiconductor chip, a synthetic plastic shaped part (I) permeable to emitting and/or receiving electromagnetic radiation, and having external electrical connections connected to the electrical contact surfaces of the semiconductor chip, where part (1) consists of reaction-cured (sic) molding composition.
机译:具有辐射发射和/或辐射接收半导体芯片的辐射发射和/或辐射接收半导体元件,可透过发射和/或接收电磁辐射的合成塑料成形零件(I),并具有连接到电接触面的外部电连接半导体芯片的一部分,其中部分(1)由反应固化的(SiC)模塑组合物组成。

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