首页> 外文学位 >CHARACTERIZATION OF INDIUM-PHOSPHIDE AND GALLIUM-ARSENIDE BY THE SURFACE PHOTOVOLTAGE TECHNIQUE (SEMICONDUCTORS, RADIATION DAMAGE, DIFFUSION LENGTH).
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CHARACTERIZATION OF INDIUM-PHOSPHIDE AND GALLIUM-ARSENIDE BY THE SURFACE PHOTOVOLTAGE TECHNIQUE (SEMICONDUCTORS, RADIATION DAMAGE, DIFFUSION LENGTH).

机译:通过表面光电压技术(半导体,辐射损伤,扩散长度)表征磷化铟和砷化镓。

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摘要

A general theory for the surface photovoltage (SPV) technique is developed. Goodman's original SPV theory is shown to be a limiting case.; The effect of the additional light produced by the radiative recombination process of electron-hole pairs in semiconductors is examined. Numerical simulation shows that it merely results in a higher effective minority carrier diffusion length, while the SPV technique remains simple to interpret.; The SPV technique is then used to determine the electron diffusion length and the optical absorption tail of a series of manganese (Mn) doped p-type indium phosphide (InP) single crystal samples. Both the electron diffusion length and the optical absorption tail are found to depend strongly on the hole concentration as well as the defect density of the crystals. Using a liquid electrolyte in contact with the semiconductor to set up the surface barrier and thus to collect the SPV signal, we demonstrate that this technique is particularly convenient and easy to apply.; A new depth profiling technique is developed to study the radiation damage in gallium arsenide (GaAs) and InP single crystals induced by the low energy ((TURN) 500 eV), high dose ((TURN) 3 x 10('18 )cm('-2)) argon ion (Ar('+)) beam milling process. This technique combines successive anodization (for removing the damaged semiconductor layer) with in situ SPV measurements (for monitoring the damage). Deep level defects in the damaged region are found within (TURN) 250 (ANGSTROM) from the milled surface.
机译:建立了表面光电压(SPV)技术的一般理论。古德曼最初的SPV理论被证明是一个极限情况。研究了半导体中电子-空穴对的辐射复合过程产生的额外光的影响。数值模拟表明,这只会导致较高的有效少数载流子扩散长度,而SPV技术仍然易于解释。然后,使用SPV技术确定一系列锰(Mn)掺杂的p型磷化铟(InP)单晶样品的电子扩散长度和光吸收尾线。发现电子扩散长度和光吸收尾部都强烈取决于空穴浓度以及晶体的缺陷密度。使用与半导体接触的液体电解质来建立表面势垒,从而收集SPV信号,我们证明了该技术特别方便且易于应用。开发了一种新的深度剖析技术,以研究低能量((TURN)500 eV),高剂量((TURN)3 x 10('18)cm()引起的砷化镓(GaAs)和InP单晶的辐射损伤'-2))氩离子(Ar('+))束铣削工艺。该技术将连续的阳极氧化(用于去除损坏的半导体层)与原位SPV测量(用于监控损坏)结合在一起。在距铣削表面的(TURN)250(ANGSTROM)内发现了受损区域的深层缺陷。

著录项

  • 作者

    CHIANG, CHING-LANG.;

  • 作者单位

    Princeton University.;

  • 授予单位 Princeton University.;
  • 学科 Physics Electricity and Magnetism.
  • 学位 Ph.D.
  • 年度 1984
  • 页码 115 p.
  • 总页数 115
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 电磁学、电动力学;
  • 关键词

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