Wafer-level electronic module, has monolithic substrate with redistribution structure for providing connector contact coupled to integrated circuit dice, where structure provides electronic device coupled to circuit dice

摘要

The module has a monolithic substrate (801) with a redistribution structure (510`) for providing a connector contact coupled to integrated circuit dice. The redistribution structure provides a passive electronic device (810) e.g. an inductor, electrically coupled to the circuit dice. The structure has a conductive layer to provide electrical connection to a contact pad of the electronic device mounted on the substrate. Independent claims are also included for the following: (A) a method of fabricating an electronic module (B) an article of manufacture having an electronic module.